NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted revenue of $4.2 billion in 2011. Additional information can be found by visiting www.nxp.com. NXP actively participates in numerous collaborative research projects and plays a key role in several European technology research programs (FP6, FP7, JTIs) and in Eureka programs (Catrene, ITEA2).
NXP is playing a leading role in IC’s in-vehicle networking; “NXP connects the car” and is driving innovation with IC’s for cleaner, safer and more enjoyable cars, while delivering quality with robust IC’s, reliable supply and excellent customer support. NXP offers diversified technology manufacturing solutions located in Europe namely in the Netherlands (Nijmegen), in Germany (Hamburg).
Further information can be found at: www.nxp.com/rfmanual
NXP sees NEMF21 as a Noisy-Electro-Magnetic-Field aware Technological Platform for 5G applications addressing the challenge: “Any-Device”, “Any-Network”, “Any-Where”, “Any-Time” with “Seamless Connectivity”.
NXP envisions Chip-Package-PCB [including antennas] Co-Design methodologies to ensure First Time Right in the realization of 5G wireless links between systems including circuits operating as Multiple-Input Multiple-Output devices.
NXP-FR in coordination with NXP-NL will be active in building Chip-to-Chip demonstrators for the RF application fields in cooperation with the academic partners UoN, TUM, CNRS, ISAE. These demonstrators will be used for evaluation of Near-Field scanning of stochastic EM fields and for benchmarking with state of the art commercial solutions.
NXP-FR will contribute in the design of passive and active elements, which will lead to the manufacturing of test-chips and their broadband characterization. It will take advantage from existing measurement facilities (110GHz VNA system, SEM failure Analysis, AFM instrumentation) from NXP-LaMIPS (Laboratoire de Microelectronique et Physique des Semiconducteurs) entity, which is a Joint Research Institute for the CRISMAT Laboratory-co-supervised by ENSICAEN, CNRS and Caen Basse-Normandie University – and NXP-Semiconductors. LaMIPS plays a vital role in the development of new technologies.
Participants from NXP-LaMIPS are:
• Sidina Wane: Chip-Package-PCB Co-Design, Co-Simulation and Experimental Co-Verification
• Dominique Lesenechal: Broadband RF and Millimeter-Wave Measurement and Characterization
• Thanh Vinh Dinh: Electromagnetic modeling/Simulation